도금 두께 측정 : 일반, Rh, Pd, Au, Ag, Sn, Ni
도금 두께 측정 iEDX-150T
도금 두께 측정
정보 :
| X-ray tube | Mo/Rh/W/Ag Target(Option), 50kVp, 1mA |
| Detection System | Si-Pin Diode (Option : SDD, FSDD) |
| Energy Resolution | Si-Pin Diode : 149eV FWHM at Mn Kα / Option : SDD(125eV), FSDD(122eV) |
| Collimator |
0.3 Collimator (Option : 0.05, 0.1, 0.2, 0.5, 1mm) Capillary Optics 50um Manual / Auto Changing Stage |
| Detection Element | Ti(22)~U(92) |
| Sample Type | Solid / Liquid / Powder, Multi-Layer |
| Size of the sample chamber | 660mmX450mmX150mm / 500mmX450mmX150mm |
| Sample stage moving possible distance |
300mmX200mmX150mm / 220mmX200mmX150mm |
| Size of the sample table | 310mm X 260mm |
| Key Features |
Auto / Manual Stage Mode Plating thickness measurement : General, Rh, Pd, Au, Ag, Sn, Ni Film thickness measurement of multilayer thin films (up to 5 Layer) |
| Camera Magnification | 40~80 x |
| Safety | 3 point interlock |
| Type of Report |
Excel, PDF / output Custom form |
| Key Benefits |
Film thickness measurement of multilayer thin films (up to 5 Layer) Convenient stage control Multi-point measurement possible RoHS Screening (Option) Remote Support by Online |
| Application |
Product screening international environmental regulations (RoHS, WEEE, ELV compliant) Hazardous material(Cr, Br, Cd, Hg, Pb, Cl, Sb, Sn, S) Screening equipment Plating analysis automobile parts, Electronic circuit board(PCB), Such as a capacitor Analysis of single-layer, Multi-layer, Alloy plating Thickness with Composition Ratio can be measure on time in alloy plating |
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