iEDX-150μT Plating thickness measurement


Plating thickness measurement : General, Rh, Pd, Au, Ag, Sn, Ni


Catalogue

iEDX-150uT

iEDX-150μT Plating thickness measurement

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    Plating thickness measurement Plating thickness measurement

    Information :

    ISP iEDX-150uT
    ISP iEDX-150uT
    ItemDetails
    X-ray tubeMo/Rh/W/Ag Target(Option), 50kVp, 1mA
    Detection SystemFSDD(Fast Silicon Draft Detector)
    Energy ResolutionSi type Detector(FSDD) 122eV FWHM at Mn Kα
    CollimatorPoly capillary optics(Focal Spot 15um/30um) FWHM
    Detection ElementTi(22)~U(92)
    Sample TypeSolid / Liquid / Powder, Multi-Layer
    Size of the sample chamber660mmX450mmX150mm / 500mmX450mmX150mm
    Sample stage moving
    possible distance
    300mmX200mmX150mm / 220mmX200mmX150mm
    Size of the sample table310mm X 260mm
    Key Features

    Auto / Manual Stage Mode

    Plating thickness measurement : General, Rh, Pd, Au, Ag, Sn, Ni

    Film thickness measurement of multilayer thin films (up to 5 Layer)

    Camera Magnification40~80 x
    Safety3 point interlock
    Type of Report

    Excel, PDF / output

    Custom form

    Key Benefits

    Micro focused measuring point(<70um) using capillary optics Film thickness measurement of multilayer thin films (up to 5 Layer) Convenient stage control Multi-point measurement possible Remote Support by on line

    Application

    Plating thickness measurement special, ENEPIG, Pd-Ni, Rh etc.

    Plating analysis automobile parts, Electronic circuit board(PCB), Such as a capacitor

    Analysis of single-layer, Multi-layer, Alloy plating

    Thickness with Composition Ratio can be measure on time in alloy plating

    If you want to know more, please contact us :

    CÔNG TY TNHH CÔNG NGHỆ VIAM VINA

    Địa chỉ trụ sở :Tầng1,Số 10 Đường Hoàng Ngân, Phường Ninh Xá, Tp.Bắc Ninh, tỉnh Bắc Ninh

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